70-3213-0810

70-3213-0810

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Manufacturer Part 70-3213-0810
Manufacturer Kester
Description SOLDER PASTE NXG1 NO CLEAN 500GM
Category Soldering, Desoldering, Rework Products
Family Solder
Lifecycle: New from this manufacturer.
Delivery: DHL FedEx Ups TNT EMS
Payment T/T Paypal Visa MoneyGram Western Union
DataSheet 70-3213-0810 PDF

Availability

InStock 366,855
UnitPrice $ 126.40000

70-3213-0810 Current price of is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team rfq@www.zhschip.com

70-3213-0810 Specifications

Type Description
Series:NXG1
Package:Bulk
Part Status:Active
Type:Solder Paste
Composition:Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter:-
Melting Point:423 ~ 424°F (217 ~ 218°C)
Flux Type:No-Clean
Wire Gauge:-
Process:Lead Free
Form:Jar, 17.64 oz (500g)
Shelf Life:8 Months
Shelf Life Start:Date of Manufacture
Storage/Refrigeration Temperature:32°F ~ 50°F (0°C ~ 10°C)

Shopping Guide

Shipping Rate
Shipping Rate

We ship orders once a day around 5 p.m., except Sundays. Once shipped, the estimated delivery time depends on the courier company you choose, usually 5-7 working days.

Shipping Methods
Shipping Methods

We provide DHL, FedEx, UPS, EMS, SF Express, and Registered Air Mail international shipping.


Payment
Payment

TT in advance (bank transfer), Western Union,PayPal. Customer is responsible for shipping fee, bank charges, duties and taxes.

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